C-flat™ Family of Holey Carbon, Gold Grids for S/TEM and Cryo-TEM
CD-flat™ for Automated S/TEM Imaging and Metrology
CD-flat is designed for CD-TEM metrology of large specimens, like 3D NAND FIB lamella.
|Grid Material||Copper Grid|
|Mesh Size||300 Mesh|
|Film Material||Holey Carbon|
|Film Thickness||40 nm thick|
|Hole Pattern||8/2 hole pattern (8 um diameter, 2 µ spacing between holes)|
Au-Flat™ for High Resolution Imaging
Au-Flat is an ultrastable Cryo-EM sample support with a 45nm holey Gold alloy film on 3 mm gold mesh grids. Au-Flat is a derivative of the patented C-Flat product.
Au-Flat improves your image quality and resolution with the gold alloy film, which reduces particle movement during imaging.
Au-Flat is offered in two configurations:
- 1.2 µm/1.3 µm hole pattern on 300 mesh Gold grids
- 2 µm/2 µm Hole Pattern on 200 mesh Gold grids
Better reconstructions with less data
Au-Flat significantly reduces beam-induced motion during imaging compared to carbon films, improving image quality and resolution.
Au-Flat features a holey Au/Pd film on a gold mesh grid, so it’s chemically inert and biologically compatible.
Au-Flat’s film is significantly stronger than carbon films and is more capable of surviving the Cryo-EM workflow including tweezer handling, glow discharge, blotting, auto-grid loading and plunge freezing.
Benefits over other Gold Foil TEM Grids
Fewer Mistakes The lighter color of the Au/Pd alloy film compared to the underlying gold mesh grid makes it easy to identify the “holey” side of the grid during sample prep. This ensures the sample is deposited on the correct side and that the grid is loaded and imaged in the correct orientation.
Stronger Au-Flat is produced with gold mesh grids that are about 6 microns thicker than typical Cryo-EM grids. This makes the grids stiffer and less likely to bend or deform. The increased thickness is fully compatible with side-entry holders as well as auto-loaders.
|Grid Material||Gold Grid|
|Mesh Size||200, 300 Mesh|
|Film Material||Gold Alloy|
|Film Thickness||45 nm thick|
|Hole Pattern||1.2/1.3 hole pattern (1.2 um diameter, 1.3 µ spacing between holes)|
2/2 hole pattern (2 um diameter, 2 µ spacing between holes)